Smart Cockpit & In-Car Entertainment

Designed for automotive smart cockpit systems, in-car infotainment head units, instrument cluster displays, and HUD (Head-Up Display) modules, our solutions deliver high-performance connectivity. We offer compact Wafer connectors and FPC connector solutions engineered to meet the rigorous demands of modern vehicles. Optimized for high-density wiring and space-constrained environments, our components ensure reliable, durable, and automotive-grade quality you can trust.

Smart Cockpits In-Car Entertainment Instrument Displays HUD Climate Control Steering Wheel Controls

Features

Key Advantages

Miniaturized 2.0/1.5mm Pitch Wafer

Locking anti-loose design

Temperature Range: -40°C to +105°C

ELV/RoHS Certified

Vibration Resistance Complies with JASO D616

100% Full Electrical Performance Inspection

Overview

In-depth Product Details & Applications

Solution Overview

The integration of smart cockpits continues to advance, demanding connectors that are smaller, multi-functional, and highly reliable. This solution features Wafer connectors to provide compact, dependable wire-to-board connectivity for in-vehicle infotainment systems, instrument clusters, and climate control panels.

Key Application Areas

Infotainment Head Units: Display driver connections, touchpad FPC, Wi-Fi/BT antennas, and USB interface modules
Instrument Cluster Assemblies: LCD display drivers, indicator light PCB connections, and multi-function steering wheel controls
HUD (Head-Up Display): Picture Generation Unit (PGU) connections, projection light source drivers, and ambient light sensors
Climate Control Modules: Panel button connections, electric damper actuators, temperature sensors, and blower motor speed control

Solution Advantages

Our locking Wafer design ensures connectors stay securely in place, even in high-vibration environments. With a wide range of pin counts (2P-16P), these connectors adapt to various functional modules. Furthermore, they support automated crimping and assembly, significantly reducing wire harness manufacturing costs.