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Samtec Launches Ultra-Low Profile Board-Level Optical Connector Solution

Samtec Unveils Ultra-Low Profile Panel-Level Optical Connector Solution Leveraging Advanced Polymer Optical Waveguide Technology Enabling High-Density Board-to-Board Optical Interconnects Delivering Ultra-High Bandwidth for Next-Generation AI Computing

Home News Industry News Samtec Launches Ultra-Low Profile Board-Level Optical Connector Solution
2026-05-23 87 Views 3 min read Listen

Samtec has just launched the all-new ultra-low profile panel-mount optical connector "FireFly" series, featuring a height of just 3.5mm, supporting data transfer rates of 25Gbps per channel, with a total bandwidth of up to 400Gbps.

This product integrates the optical engine directly into the connector, significantly simplifying system design complexity. It is specifically engineered for applications with strict space and thermal management requirements, such as AI accelerator cards, high-performance computing (HPC), and network switching equipment.

As the demand for computing power surges due to AI large model training, the adoption of optical interconnect technology at the board level is accelerating. Optical connectors are poised to become the next major growth driver in the connector industry.

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